FYTbet富易堂·(中国区)官方网站
EN/
CN
Home
About SYTECH
Group Introduction
SYTECH Value
Group Main Business
News
SUSTAINABILITY
Business Integrity
Products and Markets
All
Smart Terminal
Rigid Materials
RF Materials
Automotive Materials
Flexible Materials
IC Substrate Materials
IMS and HTC materials
Special Materials
HSD Materials
Quality & certification
Quality Management
System Certification
Safety
R&D
Engineering Research Center
CNAS Lab
CTDP Lab
Contact US
Production Base
Sales Network
About SYTECH
Home
>
About SYTECH
>
News
The New IEC Proposal of Build-up Film for Packaging Substrates Led by Shengyi Technology Has Successfully Passed Domestic Verification
